Baoji Ruihenghua Titanium Metal Composite New Materials Co., Ltd. is one of the leading manufacturers and suppliers of titanium copper conductive target in China. If you're going to buy customized titanium copper conductive target made in China, welcome to get more information from our factory. For price consultation, contact us.
Titanium Copper Conductive Target
● Main Material: TA1/TA2 industrial pure titanium cladding + T2 high-purity copper base layer, conforming to ASTM B898 and GB/T 12769 international composite material standards.
● Composite Process: Explosive bonding/hot rolling diffusion bonding dual processes are available, with atomic-level metallurgical bonding, eliminating the risk of delamination, loose connections, and contact thermal resistance drift.
● Interface Performance: Interface bonding strength ≥120MPa, composite bonding rate ≥98%, no delamination or cracking under high and low temperature cycling and long-term high power load.
● Electrical And Thermal Conductivity: The copper core has an electrical conductivity of ≥98% IACS and a thermal conductivity far exceeding that of a pure titanium target. Under heavy loads, the pressure drop is small, the temperature rise is small, and the target surface temperature is uniform.
● Corrosion And Sputtering Resistance: The titanium layer is resistant to electroplating solutions and vacuum sputtering ion bombardment, the target surface is sputtered uniformly, and the service life is more than 3 times that of pure copper targets.
● Structural Advantages: The titanium layer ensures sputtering/corrosion resistance functionality, while the copper core ensures high electrical and thermal conductivity and cooling efficiency, perfectly balancing performance and cost.
● Brand: RHHT i.
● Place Of Origin: Baoji, Shaanxi Province, China's Titanium Valley.
Product Introduction
Titanium-copper conductive targets are high-performance bimetallic composite targets, using titanium as the functional surface layer and high-purity copper as the conductive and thermally conductive core layer. They are fabricated through explosive welding or hot rolling diffusion metallurgical composite processes, achieving atomic-level strong bonding at the interface, eliminating the risks of delamination, poor connection, and thermal resistance drift. Unlike single pure titanium or pure copper targets, this composite structure perfectly integrates the excellent corrosion resistance, sputtering stability, and film adhesion of titanium with the ultra-high electrical and thermal conductivity of copper. It solves the problems of poor conductivity, high temperature rise, and high cost associated with pure titanium targets, while avoiding the defects of poor corrosion resistance and short service life of pure copper targets. The product is widely used in PVD vacuum coating, functional thin film deposition, electroplating conductive anodes, electrochemical reactions, and other scenarios, making it a cost-effective upgrade material to replace pure titanium and pure copper targets.
Product Parameter
Implement International Standards System
● Composite product standards: ASTM B898 "Standard Specification for Active Metal Composite Panels", GB/T 12769-2025 "Titanium-Copper Composite Rods" (a derivative specification for plates).
● Substrate material standards: ASTM B265 (titanium and titanium alloy plates), ASTM B152 (copper and copper alloy plates), GB/T 3620 standard for titanium and titanium alloy grades, GB/T 5231 standard for chemical composition of processed copper.
● Inspection and acceptance standards: ultrasonic flaw detection GB/T 7734, interfacial shear strength GB/T 6396, flatness inspection, surface roughness inspection, and material certificates can be issued in accordance with EN 10204 3.1.
● Environmental compliance standards: Complies with EU RoHS 2.0 directive, free of lead, cadmium, and harmful heavy metal leaching.
● Applicable operating conditions: Suitable for PVD vacuum sputtering, acidic electroplating solutions, oxidizing electrochemical media, etc., with a long-term operating temperature of ≤250℃; not suitable for high-concentration hydrofluoric acid or high-temperature concentrated alkali conditions.
Standard Materials And Structural Parameters
|
Parameter Categories |
Optional Specifications |
Illustrate |
|
Coating material |
TA1 / TA2 Industrial Pure Titanium |
TA2 has higher strength and is suitable for high-power sputtering and highly corrosive environments; TA1 has better plasticity and better target surface formability. |
|
base material |
T2 High Purity Copper |
Excellent electrical and thermal conductivity ensures efficient heat dissipation and low-loss conductivity under heavy loads. |
|
Product Form |
Planar circular targets, square targets, rectangular targets, rotating targets, and irregularly shaped targets |
It can be used to machine back target threads, cooling water channels, positioning steps and other structures. |
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Circular target size |
Diameter 50–500mm / Total thickness 5–60mm |
Compatible with various vacuum coating machines and small electroplating tanks |
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Square/rectangular target size |
Maximum side length 400×1200mm / Total thickness 5–60mm |
Suitable for large continuous coating lines and long electroplating tanks |
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Coating thickness |
Single-sided: 0.5–10.0 mm; Standard: 1.0–5.0 mm |
Thickness can be customized according to sputtering life and corrosion intensity. |
|
Composite process |
Explosive composite/Hot-rolled diffusion composite |
For thick targets, small batches, and irregular shapes, choose explosive targeting; for thin targets, large batches, choose hot rolling. |
|
Supply status |
Annealed state, finely ground and polished state, machined finished state |
Target blanks or finished target parts can be supplied as needed. |
Product Features and Applications
Product Advantages
Metallurgical composite interface with long-term stable performance: Utilizing explosive bonding or hot-rolled diffusion bonding processes, the titanium-copper interface achieves atomic-level metallurgical bonding with a bond strength ≥120MPa, eliminating common problems such as delamination, weak connections, and contact thermal resistance drift associated with mechanical pressing and brazing composites. The interface remains stable under long-term high-power sputtering, thermal cycling, and electrolyte immersion, with no long-term degradation in electrical conductivity, thermal conductivity, and sputtering performance.
Combining the advantages of two metals for outstanding cost-effectiveness: TA1/TA2 pure titanium serves as the surface layer to ensure sputtering stability, corrosion resistance, and film adhesion, while T2 copper serves as the core layer to ensure ultra-high electrical and thermal conductivity and cooling efficiency. The two metals complement each other. Compared to pure titanium targets, this significantly reduces material costs while improving heat dissipation efficiency and target surface temperature uniformity; compared to pure copper targets, it significantly improves corrosion resistance and sputtering lifespan, making it the optimal cost-effective solution for functional conductive target applications.
High-precision machining, compatible with high-end equipment: The finished target surface is precision milled and polished, with a flatness of ≤0.05mm and a surface roughness Ra≤0.8μm, and the dimensional tolerance is strictly controllable; it can be equipped with back target threads, cooling water channels, positioning steps, mounting holes and other structures, and is 1:1 compatible with various imported and domestic coating equipment and electroplating tanks. It is easy to install, fits tightly and has no thermal resistance.
Flexible and customizable formulation to suit diverse scenarios: The thickness of the titanium surface layer, the proportion of copper core, and the shape and size of the target material can all be customized as needed. The material ratio can be adjusted to meet different requirements such as sputtering priority, conductivity priority, and corrosion resistance priority. At the same time, it supports various forms such as planar targets, rotating targets, and irregular targets. It provides one-stop supply from target blank to finished target parts to meet the personalized needs of different industries and equipment.
Full-process quality control with strong batch consistency: A full-process quality control system has been established. Each batch of raw materials, semi-finished products, and finished products undergoes ultrasonic flaw detection, component testing, dimensional accuracy, flatness, and surface roughness testing to ensure that the quality, performance parameters, and dimensional accuracy of different batches of products are highly consistent, ensuring the long-term continuous operation of the production line and reducing process adjustment costs.
Application Areas
PVD vacuum coating industry: decorative coating, tool coating, functional coating sputtering back target, compatible with magnetron sputtering, multi-arc ion plating and other equipment.
Semiconductor and display industry: conductive thin film deposition for flat panel displays, sputtering target substrates for functional coatings on semiconductor wafers.
Electroplating and electrochemical industries: high-end electroplating bath conductive anode targets, electrochemical oxidation reaction targets, and conductive targets for electrolytic refining.
New energy and photovoltaic industry: functional coatings for photovoltaic cells, conductive targets for electrode material deposition in new energy batteries.
Surface engineering industry: Composite conductive targets for the preparation of anti-corrosion and wear-resistant coatings and decorative coatings.
Production line upgrade: an upgrade solution for scenarios where the original pure titanium targets are costly and have poor heat dissipation, while the pure copper targets have short lifespans and are prone to corrosion.
Product Details
Interface Standards
Composite interface bonding rate ≥98%, no continuous unbonded areas, bonding strength ≥120MPa.
01
Geometric Accuracy
Target surface flatness ≤ 0.05mm, thickness tolerance ± 0.1mm, dimensional tolerance ± 0.2mm.
02
Surface Quality
The titanium target surface is free of scratches, cracks, and pinholes, with a surface roughness Ra≤0.8μm, and is clean and free of oil stains.
03
Detection Standards
Ultrasonic testing shall be performed in accordance with GB/T 7734. The area of a single unbonded defect shall be ≤0.5 cm², and the total unbonded area shall be ≤2%.
04
Product Supporting Documents
Authoritative International Qualification Certificates
ASTM B898 composite product conformity test report, and EN 10204 3.1 original material certificate issued for each batch.
ISO 9001 Quality Management System Certification, ISO 14001 Environmental Management System Certification.
Third-party SGS test report on interface bonding strength, electrical and thermal conductivity, ultrasonic flaw detection, and flatness.
The RoHS environmental compliance test report meets the environmental requirements of the electronics, semiconductor, and coating industries.
thoughtful service
Packaging Standards (For Export By Sea)
The product's target surface is covered with a special protective film, and the entire surface is wrapped with pearl cotton + PE protective film, and then filled with a custom shockproof foam liner to provide cushioning protection at the stress points of the target surface.
The entire batch is packed into fumigated solid wood export crates, with the interior filled with shock-absorbing foam for multiple points of fixation to prevent movement, bumps, and scratches on the target surface during transportation.
The wooden crates are labeled with the product model, dimensions, quantity, gross weight, and moisture-proof/lifting/pressure-proof markings, suitable for all scenarios including sea, land, and air transport.
Professional Consultation Q&A
Q1: What are the core advantages of titanium-copper composite conductive targets compared to pure titanium and pure copper targets?
A1: The core advantage lies in achieving an optimal balance between functionality, electrical and thermal conductivity, and cost. Pure titanium targets offer excellent corrosion resistance and sputtering performance, but suffer from poor electrical and thermal conductivity, resulting in target surface temperature rise and unevenness at high power, and high material costs. Pure copper targets exhibit excellent electrical and thermal conductivity, but have poor corrosion and sputtering resistance, short service life, and are prone to contaminating the plating solution/film. The titanium-copper conductive target uses titanium as the surface layer to ensure sputtering and corrosion resistance, and copper as the core layer to ensure efficient electrical and thermal conductivity. It improves target surface temperature uniformity by 60%, has a material cost far lower than pure titanium targets, and a service life more than three times that of pure copper targets, resulting in the best overall long-term operating benefits.
Q2: Will the composite interface affect thermal and electrical conductivity, and will it cause uneven target surface temperature?
A2: Titanium-copper conductive targets produced using standard metallurgical composite processes have atomic-level bonding at the interface, with a bonding strength ≥120MPa. The interfacial contact thermal resistance and electrical resistance are extremely low, almost negligible, and will not cause uneven target surface temperature. The temperature uniformity of our finished target surfaces can be controlled within ±5℃, far superior to targets composited by mechanical pressing or brazing. Furthermore, each target undergoes full-surface ultrasonic testing before leaving the factory to ensure no unbonded defects, guaranteeing consistent performance from the source.
Q3: How to select the thickness of the titanium layer on the target surface, and what is its relationship with the service life?
A3: The thickness of the titanium layer is mainly determined by the operating power, usage time, and corrosion intensity. Higher power, longer expected lifespan, and stronger corrosion require a thicker titanium layer. For conventional decorative coatings and low-to-medium power applications, a 1–3mm titanium layer is sufficient; for high-power sputtering and highly corrosive electroplating applications, a 3–8mm titanium layer is recommended. We will calculate the titanium layer consumption rate based on your operating power, average daily usage time, and maintenance cycle, and recommend the optimal thickness to control procurement costs while meeting service life requirements.
Latest company news
Titanium-clad copper anode conductive rods for PCB electroplating have entered mass production, meeting the refined electroplating needs of high-end circuit boards.
Rooted in Baoji, Shaanxi, known as China's Titanium Valley, Baoji Ruihenghua Titanium Metal Composite Materials Co., Ltd. recently completed process optimization and capacity expansion of its production line for composite conductive rods used in electronic electroplating. The company has officially launched a series of titanium-clad copper anode conductive rods specifically designed for PCB electroplating, precisely matching the stringent requirements of high-end PCB manufacturing for uniform plating and cleanliness of the plating solution. This series uses TA1/TA2 industrial pure titanium as the outer coating and T2 high-purity copper as the conductive core. Through explosive bonding or hot extrusion diffusion processes, atomic-level metallurgical bonding is achieved, with an interface bonding strength ≥100MPa, a composite bonding rate ≥98%, and a copper core conductivity ≥98% IACS. This ensures long-term uniform and stable current distribution, effectively improving the plating uniformity of high aspect ratio through-holes and fine lines, and contributing to higher plating yields for HDI boards, multilayer boards, and rigid-flex boards. The outer titanium layer completely isolates the copper core from acidic plating solutions, preventing abnormal copper ion precipitation that contaminates the plating solution and generates anode sludge, significantly reducing the frequency of bath maintenance and auxiliary material consumption. Currently, our products fully cover three major shapes: square bars, flat bars, and round bars. They are compatible with mainstream PCB production equipment such as VCP vertical continuous electroplating lines, gantry electroplating lines, and roll-to-roll electroplating lines, and are widely used in processes such as copper plating, tin plating, and precious metal electroplating.
A comprehensive customized deep processing system provides one-stop matching for various PCB electroplating tank types and mounting structures.
Focusing on the diverse equipment specifications and differentiated production line modification needs of the PCB industry, the company has further improved its full-process customized processing capabilities for anode conductive rods. It can provide one-to-one customized solutions based on the customer's tank size, conductive base structure, and installation method. Relying on precision CNC machining centers, the company can complete the integrated processing of supporting structures such as sinking end caps, suspended conductive lugs, and copper busbar transition joints. All cut end faces are fully sealed with titanium material and undergo penetrant testing to prevent plating solution from seeping into and corroding the internal copper core. Product dimensional accuracy can be controlled within ±0.2mm, and straightness ≤0.5mm/m. It supports delivery in various states such as surface polishing and pickling passivation, and can be directly adapted to customers' existing production lines. The entire process, from composite substrate production to finished product deep processing, is completed in-house, enabling rapid response to customer needs for spare parts replenishment and customization, effectively shortening delivery cycles and helping customers reduce communication costs associated with multiple procurement and outsourcing.
Upgraded electronic plating services help PCB customers improve production line operational efficiency.
Leveraging a comprehensive quality control system and independent import/export rights, the company offers customized service solutions for the PCB electronic electroplating industry, providing end-to-end technical and supply support to domestic and international PCB manufacturers and surface treatment customers. All PCB-specific anode conductive rods undergo full-length ultrasonic testing, DC resistance testing, dimensional accuracy verification, and full visual inspection before leaving the factory. Each batch comes with an original EN 10204 3.1 material certificate and RoHS environmental compliance test report, meeting the environmental and quality traceability requirements of the electronics industry. The company has a professional electroplating application technology team that can provide pre-sales selection guidance, installation assistance, and after-sales maintenance technical support, helping customers upgrade from traditional pure copper and lead-tin anodes. Currently, the products serve many high-end PCB manufacturers in China and are exported in bulk to the electronics manufacturing markets of Southeast Asia and Europe. Adhering to the philosophy of "quality first, customer foremost," the company continuously optimizes product performance and delivery efficiency, striving to become a reliable long-term supplier of composite conductive materials in the PCB electronic electroplating field.
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