Baoji Ruihenghua Titanium Metal Composite New Materials Co., Ltd. is one of the leading manufacturers and suppliers of titanium anode for pcb horizontal plating in China. If you're going to buy customized titanium anode for pcb horizontal plating made in China, welcome to get more information from our factory. For price consultation, contact us.
Titanium Anode For PCB Horizontal Plating
● Dedicated To Adapting To Horizontal Electroplating Production Lines: The horizontal flat installation structure matches the horizontal uniform speed board feeding process of PCB boards, ensuring uniform current across the entire board surface and solving industry pain points such as thin plating at the edges and insufficient deep plating inside holes in horizontal plating.
● Standard DSA Size Stable Anode, Completely Insoluble: the entire electroplating process uses a titanium substrate + precious metal coating with no dissolution, the anode shape and electrode spacing are permanently fixed, and the coating thickness tolerance is controlled within ±5%, making it suitable for high-precision HDI circuit board production.
● The Substrate Is Made Of ASTM B265 Gr1 (TA1) High-Purity Industrial Titanium: titanium purity ≥99.6%, acid-resistant copper sulfate plating solution for long-term passivation, no substrate corrosion under long-term high current conditions, no risk of leakage and scrapping.
● No Anode Sludge Production: Unlike soluble phosphorus copper anodes, there is no copper slag or impurity precipitation throughout the production process, reducing the consumption of filter consumables, reducing the frequency of plating solution maintenance, and improving the yield of plate surfaces.
● Brand: RHHT i.
● Place Of Origin: Baoji, Shaanxi Province, China's Titanium Valley.
Product Introduction
The insoluble titanium anode plate for PCB horizontal electroplating lines is a DSA-sized, dimensionally stable anode electrode specifically developed for horizontal continuous copper plating lines. The substrate uses high-purity industrial titanium (TA1) conforming to ASTM B265 Gr1 standards, and the surface is coated with an iridium-tantalum mixed metal oxide (MMO) catalytic coating specifically designed for acidic copper plating in PCBs. Unlike vertical electroplating anodes, the flat plate structure is optimized for horizontally running PCBs with uniform speed. The uniform perforation design on the board surface accelerates the exchange and circulation of the plating solution. The anode only catalyzes the oxygen desorption reaction of water, with no dissolution loss itself, permanently maintaining the standard electrode spacing between the anode and cathode. It effectively solves industry problems caused by traditional soluble phosphorus copper anodes, such as uneven plating thickness, poor depth plating capability within holes, and rapid decomposition and consumption of additives. It is widely used in conjunction with HDI high-density circuit board horizontal electroplating equipment, pulse reverse copper plating production lines, and blind via filling electroplating equipment, helping PCB factories improve the yield rate of board plating and reduce daily maintenance costs for chemicals and filters.
Product Parameter
Implement International Standards System
● National standard for titanium anodes: GB/T 34632-2017 "Titanium Anodes Coated with Metal Oxide".
● International standard for titanium substrates: ASTM B265 Gr1 (TA1) high-purity titanium sheets.
● Electrochemical testing standard: GB/T 23614 Specification for accelerated anodic life and oxygen evolution potential testing.
● Environmental compliance: EU RoHS 2.0 compliant, lead-free and cadmium-free precious metal coating.
● Applicable plating solution system: Copper sulfate + sulfuric acid acidic copper plating solution (pH 0.5–2.0, chloride ion ≤80ppm).
Standard Materials And Structural Parameters
|
Parameter Classification |
Optional Specifications |
Detailed Description |
|
Anode substrate grade |
TA1 Gr1 High Purity Titanium Plate |
Titanium purity ≥99.6%, specifically for horizontal electroplating, with superior resistance to acid pitting corrosion compared to TA2. |
|
Titanium plate substrate thickness |
1.0mm / 1.5mm / 2.0mm / 2.5mm |
For small-scale test lines, use 1.0–1.5mm thicker sheet metal; for mass production fully automated horizontal lines, use 2.0–2.5mm thicker sheet metal. |
|
Panel punching specifications |
Aperture φ4–φ8mm, opening ratio 25%–45% |
High aspect ratio plates with a high porosity of 40%–45% are selected to improve the efficiency of drug exchange. |
|
precious metal coating system |
IrO₂-Ta₂O₅ Iridium-Tantalum Composite Coating (for PCB Copper Plating) |
Coating thickness 8–12 μm, precious metal loading 8–12 g/m²; long-life version can be upgraded to 20 g/m². |
|
Finished product size range |
Width 100–1200mm, Length 300–3000mm |
Compatible with standard tank widths of various brands of domestic and imported horizontal electroplating machines |
|
conductive terminal structure |
Single-sided/double-sided integrated titanium flat strip terminal, threaded terminal block |
Terminal thickness 3–5mm, high-purity argon arc welding for sealed welding, no plating damage. |
|
Optional structure style |
Single-layer perforated titanium anode plate, double-layer composite mesh anode plate |
The dual-layer structure is suitable for high-current pulse electroplating, resulting in more uniform current distribution. |
|
Surface pretreatment |
Sandblasting roughening of titanium plates followed by acid pickling activation enhances coating adhesion. |
The coating process involves multiple layers of repeated spraying with thermal sintering, ensuring a seamless bond and eliminating the risk of peeling. |
Product Features and Applications
Product Advantages
Adapted to horizontal board routing process, with uniform current distribution throughout: The flat-panel structure fits the horizontal electroplating tank installation layout, and the uniform perforation on the board surface allows the plating solution to flow through from top to bottom. When the PCB board passes through the anode area at a uniform speed, the current density difference between the board surface, through holes, and blind holes is greatly reduced, solving the common defects of thick in the middle and thin at the edges in horizontal plating, and is suitable for ultra-thin fine circuit HDI boards.
Insoluble DSA anode, constant electrode distance, and stable coating consistency: Unlike phosphorus copper anodes that are continuously dissolved and consumed, the titanium substrate + precious metal coating is not consumed throughout the process, the anode shape and size remain unchanged, and there is no need to frequently adjust the anode-cathode distance for long-term mass production. The copper layer thickness of the entire batch of PCBs fluctuates very little, and the product consistency is greatly improved.
Special iridium-tantalum coating significantly reduces electroplating additive consumption: The coating ratio is optimized for the oxygen evolution reaction in acidic copper plating, resulting in a lower oxygen evolution catalytic potential. This reduces the oxidation and decomposition of organic leveling agents and brighteners, reducing the monthly agent replenishment amount for customers by more than 30%, and significantly saving on electroplating consumable operating costs.
Zero anode sludge simplifies plating solution maintenance: No copper ions or anode impurities are continuously released, and no copper slag is produced in the tank, extending the replacement cycle of filter elements and activated carbon, reducing downtime for maintenance, and eliminating plating defects such as particles and pinholes on the board surface, thus improving yield.
Thickened high-purity titanium substrate, resistant to long-term acidic plating solution corrosion: Using Gr1 high-purity titanium plate, a stable passivation film is quickly formed in the sulfuric acid-copper sulfate system, and high-current continuous production is free from substrate pitting corrosion and leakage; integrated sealed welding terminals prevent electrolyte from seeping into the weld and corroding the substrate.
The titanium substrate can be repeatedly decoated and recoated, reducing long-term procurement costs: After the coating is exhausted, the titanium substrate is intact and undamaged, and can be recycled by removing the old coating and recoating the precious metal catalyst layer for reuse. Compared with disposable anodes, long-term procurement costs are reduced by more than 40%.
Application Areas
PCB high-density circuit board manufacturing: fully automated horizontal continuous copper plating production line, HDI blind via filling electroplating equipment.
Pulse reverse electroplating process: High-end precision PCB pulse horizontal electroplating line, improving deep plating capability and plating smoothness.
IC substrates and FPC flexible circuit boards: Low-current uniform anode plates for ultra-thin sheet metal horizontal electroplating.
Electrolytic copper foil production: foil making machine, copper foil post-processing electrolytic cell, high current conductive beam.
Small and medium batch testing equipment: laboratory small-scale horizontal electroplating sample machine, pilot electroplating tank with matching anode.
Circuit board post-processing steps: horizontal nickel plating and tin plating to assist insoluble titanium anode electrodes.
Production Details
Coating Control
Each layer is sintered in sections after spraying to prevent uneven coating thickness, and the precious metal load is recorded and traced for each board.
01
Welding Quality Control
All terminal welds undergo 100% penetrant testing to prevent tiny gaps from seeping into the plating solution and corroding the titanium substrate.
02
Flatness standard
The warpage of the finished anode plate is ≤0.8mm/m to ensure uniform electric field output in the horizontal tank.
03
Abrasion resistance test
The coating was subjected to high-speed liquid circulation and rinsing on a simulated production line for 72 hours, and there were no defects such as coating peeling or exposed titanium.
04
Product Supporting Documents
Authoritative International Qualification Certificates
TA1 titanium sheet original material certificate, MMO coating precious metal load, anodized accelerated life test report, and original material certificate of EN 10204 3.1 for each batch.
ISO 9001 Quality Management System Certification, ISO 14001 Environmental Management System Certification.
SGS third-party sampling test report on chemical composition, coating adhesion, and electrochemical performance.
RoHS 2.0 environmental testing report, meeting the environmental control standards for high-end electronic PCB manufacturing.
thoughtful service
Packaging Standards (For Export By Sea)
Each titanium anode plate is wrapped with an anti-static PE protective film on both sides, and the plate surface is fully covered with pearl cotton for isolation to prevent the coating from being bumped or scratched.
Multiple finished pieces are layered and fixed in a fumigated solid wood export crate, with an internal hardwood frame for restraint, preventing warping and deformation during transportation.
The wooden crates are clearly marked with product specifications, quantity, moisture-proof, and handle with care labels, making them suitable for domestic land transportation, port sea transportation, and China-Europe freight train logistics.
Professional Consultation Q&A
Q1: Why is TA1 Gr1 titanium substrate preferred for the anode of horizontal electroplating lines on PCBs, instead of TA2 titanium?
A1: Horizontal electroplating production lines operate continuously at high current for extended periods, with acidic plating solutions constantly scouring the anode surface. TA1 high-purity titanium has a lower impurity content, stronger passivation film stability, and better resistance to pitting corrosion than TA2, which can prevent localized substrate corrosion and titanium leakage during long-term use. TA2 is more suitable for intermittent small-scale electroplating test equipment and is not recommended for use on 24-hour mass production horizontal lines.
Q2: Compared with traditional phosphorus copper anodes, where does the overall production cost advantage of insoluble titanium anodes lie?
A2: ● The anode is not continuously consumed, so there is no need to frequently add copper balls or replace the anode basket;
● Significantly reduces oxidation loss of brighteners and leveling agents, and reduces the amount of chemicals used by 30%;
● No anode sludge, extending the replacement cycle of filter consumables and activated carbon;
● The coating is uniform and stable, reducing the PCB defect rate and scrap rate; long-term mass production operating costs are reduced by more than 25%.
Q3: After the titanium anodic coating fails, can the titanium substrate still be reused?
A3: Yes. Our company supports the recycling of old titanium substrates, removal of failed coatings, re-blasting and activation, and application of a new iridium-tantalum precious metal coating. After repair, the anodic electrochemical performance is consistent with that of a brand new product; only the cost of the precious metal coating is consumed, without the need to repurchase the entire titanium plate, significantly reducing the long-term procurement expenses for customers.
Latest company news
A dedicated intelligent production line for PCB water treatment anodes has officially commenced operation, significantly upgrading the company's capabilities in delivering electronic wastewater treatment solutions.
Leveraging the advantages of Baoji's "China Titanium Valley" raw material and processing industrial cluster, our company has completed the expansion and implementation of a fully intelligent production line for PCB-specific submerged anodes. This expansion includes the addition of fully automated equipment for titanium substrate sandblasting and activation, segmented sintering of precious metal coatings, and integrated online electrochemical monitoring. Addressing the needs of PCB industry processes such as etching wastewater recovery, electroplating wastewater COD degradation, and ammonia nitrogen removal, we have optimized ruthenium-iridium/iridium-tantalum dual-series coating formulations, resolving the pain points of traditional anodes such as low electrolysis efficiency, easy coating peeling, and short service life. We can mass-produce customized mesh, board, and tubular fully submerged submerged titanium anodes, shortening the delivery cycle of non-standard customized orders by 30%. We provide one-stop wastewater electrolysis treatment anode products for major PCB industrial parks and circuit board manufacturers across China.
The iterative development of PCB underwater anodic electrochemical coating technology has enabled low-loss, long-lasting anodes to replace imports.
The company's R&D team focuses on continuous technological breakthroughs in electronic manufacturing wastewater treatment. Specifically addressing the highly corrosive conditions of PCB high-chlorine and acidic etching wastewater, they have optimized the TA1 high-purity titanium substrate pretreatment process and the multi-layer precious metal thermal sintering process. The new generation of PCB-specific water-based anodes possesses three core advantages: low chlorine evolution potential, high pollutant degradation efficiency, and strong coating adhesion. At the same current density, reagent consumption is reduced by 28%, and the continuous stable service life is increased by 40%. Its electrochemical performance is comparable to imported products, making it a complete replacement for overseas brand water-based anodes. This significantly reduces the maintenance and spare parts procurement costs of environmental protection equipment in PCB factories, contributing to the localization and upgrading of domestic PCB environmental protection equipment.
With a well-established end-to-end standardized quality control system and a comprehensive global logistics service network, the delivery guarantee for PCB customers both domestically and internationally is strengthened.
The company has upgraded its quality inspection standards for PCB water-soluble anodes. All fully submersible titanium anodes for water treatment simultaneously comply with both the national standard GB/T 34632 and the international standard ASTM. Each anode undergoes a full set of tests for accelerated life, chlorine evolution efficiency, and coating adhesion. Each batch of products comes with an EN 10204 3.1 material testing certificate and an SGS environmental testing report. Leveraging its own import and export logistics channels, the company offers multiple shipping options including sea freight, air freight, and China-Europe freight train, along with a 7-day free replacement guarantee for non-human-caused quality issues. Products are currently supplied in bulk to major PCB production bases in South and East China, and are also exported to electronics manufacturing industrial parks in Southeast Asia and Europe. With its core advantages of corrosion resistance, high electrolysis efficiency, and recyclability, the company has gained long-term and stable cooperation and recognition from global PCB manufacturers, establishing itself as a benchmark domestic manufacturer of water-soluble anodes for PCB wastewater treatment.
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